Reliable Testing and Analysis

ASC  offers a single reliable source for component-level electrical and environmental testing, radiation testing, failure analysis, and destructive or nondestructive physical testing and analysis for programs and projects of all sizes.We use third-party testing facilities that have all of the following services.

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State-of-the-art facilities and multidisciplined technical professionals, component test and analysis labs they serve a wide range of government and commercial clients.

Benefits of working with our third-party testing facilities  include:

• Comprehensive laboratory testing and related engineering consulting tailored to your specific needs

• Our research database, which makes 25 years of test and analysis experience readily available for the benefit of new projects

• Proven support for defense, space, aerospace, electronics, medical, automotive, satellite, and durable goods applications

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Capabilities Overview

Our third-party labs and their Component Test and Analysis team specialize in electronic and mechanical components such as hybrids, connectors, cables, harnesses, passive or discrete components, and digital or linear devices. The test lab has extensive experience in developing test software to electrically and environmentally characterize virtually any integrated circuit, including analog, digital, mixed-signal, converters, FPGA and ASICs, as well as experience in developing actual radiation environments for parts testing. The component analysis team offers the analytical expertise and advanced instrumentation to identify root cause explanation for a wide range of component-level failures, as well as the resources to evaluate for possible quality and reliability issues through non-destructive and destructive techniques. With access to a detailed database, the Component Test and Analysis team offers a 25-year history of test and analysis data — a valuable resource for addressing new customer requirements.

Component Evaluation and Test Lab – A full-service facility that evaluates and tests components for commercial, airborne, military, space and other applications. Capabilities include testing for design verification, component characterization, upgrade, screening, qualification, and environmental factors. Other special services: radiation characterization and lot acceptance testing, latch-up, single event upset, and neutron testing.

Failure Analysis and Destructive Physical Analysis – A full-service facility that provides analytical expertise and tools necessary to determine the root-cause explanation for any electrical, mechanical, or material issues related to component or assembly failures. The lab also performs destructive analyses to ascertain the compliance of a manufacturer's process and workmanship, and to ensure that high-reliability components or assemblies are fabricated to the required standards. Additional tests and analysis capabilities are processed as technical service requests.

Counterfeit Parts Detection Mitigation Solution

Raytheon laboratories are fully qualified to address the proliferation of counterfeit, remarked and recycled parts and materials in the electronics manufacturing industry. Our parts history database spans 25 years, allowing us to compare records of known parts with our test results to draw conclusions about material integrity, manufacturing methods and origin.

With state-of-the-art facilities and knowledgeable teams of technical professionals, CTAL serves a wide range of government and commercial clients. Our capabilities are honed to meet customers’ counterfeit mitigation needs and focus on ever-changing threats to the supply chain. We provide centralized component-level electrical testing, failure analysis, counterfeit components detection and destructive or nondestructive physical testing for programs and projects of all sizes. Some of the benefits of working with our team include:

• Proven lab support for sophisticated defense, space, aerospace, and electronics products and systems as well as for medical, automotive and durable goods applications

• Comprehensive engineering consulting services tailored to customer needs

• A single, reliable source for a broad spectrum of testing, analysis, design and development services

 

Component Evaluation and Test Available From our third-party test houses

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Electrical Testing

• Digital, linear, ASICs

• Wafer probing

• Semiconductors

• RF and microwave

• Passive and magnetics

• Opto-electronics

• Time Domain Reflectometry (TDR)

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Radiation Testing

• Total dose gamma

• Neutron Fluence

• Dose Rate

• Single Event Environments

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Environmental Testing

• Burn-in

• Temperature cycling

• Humidity

• Constant acceleration

• Data acquisition

• Highly accelerated stress test (HAST)

• Thermal shock

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Certifications of our third-party test houses include:

• DLA Lab Suitability per MIL-STD-750 and MIL-STD-883

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Component Failure Analysis and Destructive Physical Analysis

Imaging

• Radiography (real-time and computed tomography (CT))

• Infrared thermography (hot spot detection)

• Infrared thermal mapping

• Photoemission microscopy

• Scanning electron microscopy (SEM)

• Energy Dispersive X-ray analysis

• C-mode Scanning Acoustic Microscopy (C-SAM)

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Destructive

• Cross-sectional and metallographic analysis

• Chemical decapsulation/depotting

• Mechanical delidding

• Particle retrieval and analysis

• Dye penetrant examination

• Dimensional measurements

• Photomicrography

• Die/ball/bump shear, bond pull

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Certification

• NAS 410 Level III in radiographic testing (RT), ultrasonic testing (UT), penetrant testing (PT)

• AS9100

• OSHA VPP

• IDEA-ICE-3000

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Special Capabilities

• Counterfeit components identification

• Prohibited materials testing (in-house or off-site)

• Materials analysis

  • Thermal Analysis (TGA/DSC/TMA)

  • Gas Chromatography/Mass Spectroscopy

  • Fourier Transform Infrared Spectroscopy (FTIR)

  • Raman Spectroscopy

  • Hardness (Rockwell, Knoop, Vickers, and Shore)

  • Tensile Strength, Elongation, and Fatigue

• Construction analysis

• Fractography

• Semiconductor (die-level) microprobing

• Particle impact noise detection (PIND)

• Hermetic seal testing (fine and gross)

• Lot evaluation (LAT, freshness, screening)

• Microhardness testing (Vickers, Knoop)

• Hardness testing (Rockwell)

• Solderability testing

• Analytical Modeling of Mechanical Systems

• PWB inspection

• Failure Analysis

• Focused Ion Beam

  • Cross Sectional Analysis

  • Circuit Edits

  • Elemental Analysis